Heat exchange – With retainer for removable article – Electrical component
Reexamination Certificate
2002-01-14
2004-01-20
Bennett, Henry (Department: 3743)
Heat exchange
With retainer for removable article
Electrical component
C165S104260, C165S104210, C165S168000, C361S699000, C361S700000, C257S715000
Reexamination Certificate
active
06679315
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a chip cooling assembly and more particularly to a very small-scale chip cooling assembly for efficiently and effectively cooling small but powerful electronic microprocessors or other small, heat generating devices.
2. Description of the Related Art
As microprocessors, such as Intel's Pentium brand series, become more powerful, they also generate more heat. To prevent failure and to ensure optimum capability, it is necessary to remove heat and to maintain the temperature of these microprocessors within a predetermined range. A number of different devices trying to accomplish this have been patented. These include the use of cold plates, microchannels, impingement jets and variations and combinations of these as well as other cooling devices. See for example, U.S. Pat. Nos. 4,392,362; 4,941,530; 5,183,104; 5,169,372; 5,394,936; 5,544,696; 5,696,405; and 5,870,823. The search, however, goes on for more effective, efficient and reliable cooling mechanisms.
BRIEF SUMMARY OF THE INVENTION
The below described embodiment improves upon the prior efforts and is a small scale cooler system comprising a housing, an inlet port formed in the housing for receiving a refrigerant or similar fluid, an outlet port formed in the housing, a thermally conductive element connected to the housing, an evaporator chamber operatively communicating with the housing where heat exchange takes place, a capillary passage formed in the housing extending downstream from the inlet port, and an expansion zone formed downstream of the capillary passage and in fluid communication with the evaporator chamber.
There are a number of advantages, features and objects achieved with the present invention which are believed not to be available in earlier related devices. For example, one advantage is that the present invention provides a very effective cooling system for very small heat dissipating items, such as electronic microprocessors. Another object of the present invention is to provide a small cooling system which is simple, reliable and economical. Yet another feature of the present invention is to provide a cooling system which is very small scale and easily attached to a small heat generating device. Yet a further feature of the present invention is to provide a cooling system flexible enough to transfer heat by forced convection, flow boiling, and pool boiling and any combination thereof.
A more complete understanding of the present invention and other objects, advantages and features thereof will be gained from a consideration of the following description of the preferred embodiment read in conjunction with the accompanying drawing provided herein.
REFERENCES:
patent: 3361195 (1968-01-01), Meyerhoff et al.
patent: 4151548 (1979-04-01), Klein et al.
patent: 4392362 (1983-07-01), Little
patent: 4498118 (1985-02-01), Bell
patent: 4561040 (1985-12-01), Eastman et al.
patent: 4612978 (1986-09-01), Cutchaw
patent: 4685512 (1987-08-01), Edelstein et al.
patent: 4866570 (1989-09-01), Porter
patent: 4940085 (1990-07-01), Nelson et al.
patent: 4941530 (1990-07-01), Crowe
patent: 5067047 (1991-11-01), Azar
patent: 5088005 (1992-02-01), Ciaccio
patent: 5099311 (1992-03-01), Bonde et al.
patent: 5099910 (1992-03-01), Walpole et al.
patent: 5159529 (1992-10-01), Lovgren et al.
patent: 5169372 (1992-12-01), Tecco
patent: 5179500 (1993-01-01), Koubek et al.
patent: 5183104 (1993-02-01), Novotay
patent: 5218515 (1993-06-01), Bernhardt
patent: 5220809 (1993-06-01), Voss
patent: 5285347 (1994-02-01), Fox et al.
patent: 5316075 (1994-05-01), Quon et al.
patent: 5365749 (1994-11-01), Porter
patent: 5394936 (1995-03-01), Budelman
patent: 5509468 (1996-04-01), Lopez
patent: 5544696 (1996-08-01), Leland
patent: 5587880 (1996-12-01), Phillips et al.
patent: 5696405 (1997-12-01), Weld
patent: 5769154 (1998-06-01), Adkins et al.
patent: 5823005 (1998-10-01), Alexander et al.
patent: 5870823 (1999-02-01), Bezama et al.
patent: 6039114 (2000-03-01), Becker et al.
patent: 2003/0010050 (2003-01-01), Scott
patent: WO 84/02177 (1984-06-01), None
Little William, Mar. 1978, IBM Corp, vol. 20 No. 10. p. 3919.*
“Pool Boiling Heat Transfer From Plain and Microporous, Square Pin-Finned Surfaces in Saturated FC-72”; K.N. Rainey and S.M. You; Journal of Heat Transfer, vol. 122, pp. 509-516, Aug. 2000.
“Effects of Perpendicular Flow Entry on Convective Heat/Mass Transfer From Pin-Fin Arrays”; Chyu et al.; Journal of Heat Transfer; vol. 121, pp. 668-674, Aug. 1999.
“Pool Boiling Heat Transfer With an Array of Flush-Mounted, Square Heaters on a Vertical Surface”; S.M. You et al; Journal of Electronic Packaging; vol. 119, pp. 17-24, Mar. 1997.
“Combined Pressure and Subcooling Effects on Pool Boiling From a PPGA Chip Package”; A.A. Watwe et al; Journal of Electronic Packaging, vol. 199, pp. 95-105, Jun. 1997.
“Analytic Modeling, Optimization, and Realization of Cooling Devices in Silicon Technology”; Perret et al.; IEEE Transactions on Components and Packaging Technologies, vol. 23, No. 4, pp. 665-671, Dec. 2000.
“An Electrodynamic Polarization Micropump for Electronic Cooling”; J. Darabi and D. DeVoe; Journal of Microelectromechanical Systems, vol. 10, No. 1, pp. 98-106, Mar. 2001.
“Heat Transfer from Micro-Finned and Flat Surfaces to Flow of Fluorinert Coolant; Boiling Heat Transfer”; Mizunuma et al.; 1998 InterSociety Conference on Thermal Phenomena, pp. 386-391, Aug. 1998.
“Imersion Cooling of Electronics in Fluidized Beds of Dielectric Particles”; Robert C. Brown and Scott S. Jasper; Heat Transfer Engineering, vol. 10, No. 3 pp. 36-42, 1989.
“Optimal Structure for Microgrooved Cooling Fin fo High-Power LSI Devices”; S. Sasaki and T. Kishimoto; Electronics & Mechanics Technology Laboratories, Oct. 21, 1986.
“Gas Cooling Enhancement Technology for Integrated Circuit Chips”; Kishimoto et al.; IEEE Transactions of Components, Hybrids, and Manufacturing Technology, vol. CHMT-7, No. 3, pp. 286-293, Sep. 1984.
“The Effect of Tip Convection on the Performance and Optimum Dimensions of Cooling Fins”; K. Laor and H. Kalman; Int. Comm. Heat mass Transfer, vol. 19, pp. 569-584, 1992.
Cosley Michael R.
Fischer Richard L.
Thiesen Jack H.
Willen Gary S.
Bennett Henry
Duong Tho V
Jones Day
Marconi Communications Inc.
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