Measuring and testing – Fluid pressure gauge – Diaphragm
Reexamination Certificate
2007-07-05
2009-02-24
Allen, Andre J (Department: 2855)
Measuring and testing
Fluid pressure gauge
Diaphragm
C438S053000, C257S419000
Reexamination Certificate
active
07493822
ABSTRACT:
A gauge pressure sensor apparatus and a method of forming the same. A constraint wafer can be partially etched to set the diaphragm size, followed by bonding to a top wafer. The thickness of the top wafer is either the desired diaphragm thickness or is thinned to the desired thickness after bonding. The bonding of top wafer and constraint wafer enables electrochemical etch stopping. This allows the media conduit to be etched through the back of the constraint wafer and an electrical signal produced when the etching reaches the diaphragm. The process prevents the diaphragm from being over-etched. The invention allows the die size to be smaller than die where the diaphragm size is set by etching from the back side.
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Davis Richard A.
Morales Gilberto
Stewart Carl E.
Allen Andre J
Honeywell International , Inc.
Lopez Kermit D.
Ortiz Luis M.
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