Coherent light generators – Particular active media – Semiconductor
Reexamination Certificate
2000-05-31
2002-02-19
Scott, Jr., Leon (Department: 2881)
Coherent light generators
Particular active media
Semiconductor
Reexamination Certificate
active
06349105
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention pertains to optoelectronic devices or optical subassemblies. The invention more particularly concerns a small format optoelectronic package.
2. Discussion of the Background
Optoelectronic devices such as optical transceivers are known in the art and include active optical devices or diode packages. Common diode packages include LED packages such as a TO-46 package or a 5.6 mm TO style laser diode package such as an RLD-85PC diode package by Rohm, Incorporated. These diode packages or TO cans typically include a metallic housing having a laser diode or LED for transmitting data and a photo diode for performing power-monitoring, metal contact leads exiting from the diodes for connection to a power source and a cover glass opposed to the diode, through which the energy is transmitted. Discussion of the power-monitoring and feedback control of the laser diode by the photo diode is presented in U.S. Pat. Nos. 5,812,582 and 5,815,623. U.S. Pat. Nos. 5,812,582 and 5,815,623 are hereby incorporated herein by reference. The TO can is hermetically sealed. Often, optics housings are metallic so as to provide ruggedness, ease of machining complicated shapes, and to enhance shielding of electromagnetic fields.
Smaller optoelectronic packages allow the devices into which the optoelectronic packages are placed to become smaller. Smaller optoelectronic packages allow for a higher density of data transmission in a given space. Currently, there is a great demand for smaller optoelectronic packages.
FIG. 8
is a partial cross-sectional pictorial view of an optoelectronic package
200
. The optoelectronic package
200
includes a base element
212
, posts
206
,
208
,
210
, extending through the base element
212
and secured thereto with solidified molten glass
214
, a monitor diode
204
mounted on the base element
212
, an optical emitting element
202
mounted on the monitor diode
204
, a can
218
and lens
216
enclosing the monitor diode
204
and the optical emitting element
202
. In an effort to reduce space, the optical emitting element
202
is mounted on top of the monitor diode
204
. Electrically conductive posts
206
,
208
,
210
extend through through-holes in the electrically conductive base element
212
. The posts
206
,
208
,
210
are electrically insulated from the base element
212
by solidified molten glass
214
which also attaches the posts
206
,
208
,
210
to the base element
212
. The posts
206
,
208
,
210
are large as compared to the other components and require a large area for their mounting and placement.
At minimum, the diameter across the base element
212
is approximately 3.8 millimeters, as incorporated on the SLT2160-LN series of transmitter optical sub-assemblies manufactured by Sumitomo Electric Industries, Ltd. Thus, if two of these devices are placed side-by-side, on the same plane, the distance between the optical axes is, hypothetically, at best, 3.8 millimeters. However, typically, the optical axes are separated by 6.25 millimeters, due to packaging constraints as in typical LC duplex transceivers such as Methode Electronics, Inc.'s, part number MLC-25-4-X-TL which is described in the data sheet entitled, “MLC-25-4-X-TL Optical Gigabit Ethernet —+3.3V Small Form Factor (SFF) Transceiver—1.25 GBaud.”
Therefore, there is a need in the industry for a small format optoelectronic package that has a small diameter and is easy to manufacture. Furthermore, there is a need for an optoelectronic package that can be placed adjacent to another optoelectronic package.
SUMMARY OF THE INVENTION
Therefore, it is an object of the present invention to provide a small format optoelectronic device.
It is still another object of the invention to provide a small format optoelectronic device which is hermetically sealed and economical to manufacture.
Yet another object of the invention is to provide a small format optoelectronic device which is able to be placed adjacent to another small format optoelectronic device.
It is a further object of the invention to provide a small format optoelectronic device which is easy to install, and provides for more efficient utilization of the limited surface area by incorporating rectangular geometry.
In one form of the invention, the small format optoelectronic package or device includes a non-electrically conductive substrate partially covered by an electrically conductive can. The electrically conductive can has a transparent element affixed to an aperture of the electrically conductive can. The electrically conductive can encloses and hermetically seals an optical diode between the electrically conductive can and the non-electrically conductive substrate. The non-electrically conductive substrate has two through-holes formed through a thickness of the non-electrically conductive substrate. The two through-holes are filled with an electrically conductive material so as to form two electrically conductive vias. When co-fired with the substrate, the electrically conductive vias form a hermetic seal. Additionally, a surface of the non-electrically conductive substrate is organized into three regions. The third region has the electrically conductive plating material applied thereto. The first through-hole protrudes through the first region. The second through-hole protrudes through the second region. The first region has a first surface. The second region has a second surface. The first surface is at a different elevation than the second surface. The optical diode has a first lead or contact electrically connected to the first via, and the optical diode has a second lead electrically connected to the second via. The optical diode has a third surface, where the third surface is substantially coplanar with the second surface.
In another form of the invention, the small format optoelectronic package or device includes a non-electrically conductive substrate partially covered by an electrically conductive can. The electrically conductive can has a transparent element affixed to an aperture of the electrically conductive can. The electrically conductive can encloses and hermetically seals an optical diode between the electrically conductive can and the non-electrically conductive substrate. The non-electrically conductive substrate has two through-holes formed through a thickness of the non-electrically conductive substrate. The two through-holes are filled with an electrically conductive material so as to form two electrically conductive vias. When co-fired with the substrate, the electrically conductive vias form a hermetic seal. Additionally, a surface of the non-electrically conductive substrate is organized into two regions. The second region has the electrically conductive plating material applied thereto. The first through-hole protrudes through the first region. The second through-hole protrudes through the first region. The optical diode has a first lead and a second lead. The first lead of the optical diode electrically connected to the first conductive via. A flex connector has a conductive trace. The conductive trace of the flex connector electrically connects the second lead of the optical diode to the second conductive via.
In yet another form of the invention, the small format optoelectronic package or device includes a non-electrically conductive substrate partially covered by an electrically conductive can. The electrically conductive can has a transparent element affixed to an aperture of the electrically conductive can. The electrically conductive can encloses and hermetically seals an optical diode between the electrically conductive can and the non-electrically conductive substrate. The non-electrically conductive substrate has two through-holes formed through a thickness of the non-electrically conductive substrate. The two through-holes are filled with an electrically conductive material so as to form two electrically conductive vias. When co-fired with the substrate, the electrically conductive vias form a hermetic se
Erickson Scott
Gilliland Patrick B.
Jines Carlos
Rapala Gregg
Washburn Theodore
Jr. Leon Scott
Kovach Karl D.
Stratos Lightwave, Inc.
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