Small form factor molded memory card and a method thereof

Details Small form factor molded memory card and a method thereof Small form factor molded memory card and a method thereof

2007-01-18

2009-10-13

Thai, Luan C (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C438S127000, C438S124000, C438S106000, C257S678000, C257S679000, C257S723000, C257S724000, C257SE29170

Reexamination Certificate

active

07601563

ABSTRACT:
A shape-molding structure of a memory card comprises a circuit substrate, at least one chip, and an encapsulant covering. The upper and lower surfaces of the circuit substrate have a circuit layer and a plurality of electric contacts, respectively. The chip is located on the upper surface of the circuit substrate and electrically connected with the circuit layer. The encapsulant covering is formed by using a mold to press encapsulant entering at least one encapsulant inlet provided on at least one side surface of the circuit substrate. The encapsulant covering encapsulates all the above components with only the electric contacts exposed. A trace mark of the encapsulant inlet remaining on the encapsulant covering is then cut to obtain a shape-molding structure of memory card with an smooth and intact outer appearance.

REFERENCES:
patent: 6444501 (2002-09-01), Bolken
patent: 6624005 (2003-09-01), DiCaprio et al.
patent: 2004/0090829 (2004-05-01), Miura et al.
patent: 2006/0281229 (2006-12-01), Koh et al.

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