Slurry supply unit for CMP apparatus

Details Slurry supply unit for CMP apparatus Slurry supply unit for CMP apparatus

2006-10-30

2008-09-02

Rose, Robert (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Computer controlled

C451S060000, C451S446000

Reexamination Certificate

active

07419419

ABSTRACT:
A slurry supply unit for a CMP apparatus is disclosed. The slurry supply unit includes a slurry flow sensor in a slurry injection pipe to measure the flow of the injected slurry, an auxiliary pump engaged with a slurry distribution line to discharge the slurry at a predetermined flow, and a slurry flow control section regulating the flow of the discharged slurry by controlling the auxiliary pump if the flow of the slurry as measured by the slurry flow sensor deviates from a preset reference. Here, the slurry supply unit may be used in a CMP apparatus including a slurry supply tank; a slurry circulation line connected to the slurry supply tank; a main pump circulating the slurry in the slurry circulation line; a CMP unit; and a slurry distribution line from the slurry circulation line to the slurry injection pipe of the CMP unit. If a planarization process of a semiconductor wafer is performed using the slurry supply unit, the amount of the slurry supplied to the apparatus can be controlled more precisely.

REFERENCES:
patent: 4513894 (1985-04-01), Doyle et al.
patent: 5490809 (1996-02-01), Jones et al.
patent: 5857893 (1999-01-01), Olsen et al.
patent: 5945346 (1999-08-01), Vanell et al.
patent: 5993299 (1999-11-01), Chen et al.

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