Slurry supply system for chemical mechanical polishing

Details Slurry supply system for chemical mechanical polishing Slurry supply system for chemical mechanical polishing

1998-08-14

2000-05-02

Gulakowski, Randy

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

451527, B24B 2104

Patent

active

060568518

ABSTRACT:
A chemical mechanical polishing apparatus for semiconductor wafers that ensures uniform planarization of said wafers is described. Said chemical mechanical polishing apparatus comprises a slurry supply system that channels slurry through the platen and pad, and a carrier head with provision to hold the wafer. The pad contains grooves for uniform distribution of the slurry under the rotating wafer thus eliminating uneven planarization as in prior art.

REFERENCES:
patent: 3615955 (1971-10-01), Regh
patent: 5246525 (1993-09-01), Sato
patent: 5492594 (1996-02-01), Burke et al.
patent: 5650039 (1997-07-01), Talieh
patent: 5899799 (1999-05-01), Tjaden et al.

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