Slurry managing system and slurry managing method for wire saws

Stone working – Sawing – Endless

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451446, 451 60, 209 17, 209 18, B24D 108

Patent

active

057996431

ABSTRACT:
A slurry managing system for a wire saw is disclosed. The wire saw includes a wire that has a plurality of wire lines extending in parallel to one another. The wire is supplied with slurry containing abrasive grains in dispersing liquid to cut a workpiece so as to simultaneously produce a multiplicity of wafers. A mixer device mixes the slurry prior to supplying of the slurry to the wire saw. A first supplying device supplies the grains to the mixer device. A second supplying device supplies the dispersing liquid to the mixer device. A first adjusting device adjusts the amount of the grains supplied to the mixer device from the first supplying device. A second adjusting device adjusts the amount of the liquid supplied to the mixer device from the second supplying device.

REFERENCES:
patent: 4059929 (1977-11-01), Bishop
patent: 4762422 (1988-08-01), Toncelli
patent: 4872975 (1989-10-01), Benson
patent: 5080807 (1992-01-01), Carr et al.
patent: 5285903 (1994-02-01), Sorenson et al.
patent: 5287975 (1994-02-01), Chumley et al.
patent: 5295583 (1994-03-01), Bischofberger et al.
Semco Corporation Product Brochure: Slurry Mixing System, Apr. 1, 1997.

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