Slurry injection and recovery method and apparatus for chemical-

Details Slurry injection and recovery method and apparatus for chemical- Slurry injection and recovery method and apparatus for chemical-

1995-12-27

1999-03-02

Rose, Robert A.

Abrading

Abrading process

Abradant supplying

451 41, 451446, B24B 1922, B24B 5702

Patent

active

058762710

ABSTRACT:
A method and apparatus for polishing a thin film formed on a semiconductor substrate. A table covered with a polishing pad is orbited about an axis. Slurry is delivered through a plurality of spaced-apart holes formed through the polishing pad to uniformly distribute slurry across the pad surface during polishing. Slurry extraction holes are interspersed between the slurry delivery holes to facilitate the removal of slurry from the polishing pad surface. A substrate is pressed face down against the orbiting pad's surface and rotated to facilitate, along with the slurry, the polishing of the thin film formed on the substrate.

REFERENCES:
patent: 4831784 (1989-05-01), Takahashi
patent: 5185966 (1993-02-01), Mock, Jr. et al.
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5230184 (1993-07-01), Bukhman
patent: 5232875 (1993-08-01), Tuttle et al.
patent: 5351445 (1994-10-01), Takahashi
patent: 5584749 (1996-12-01), Mitsuhashi et al.

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