Slurry formulation for chemical mechanical polishing of metals

Details Slurry formulation for chemical mechanical polishing of metals Slurry formulation for chemical mechanical polishing of metals

1996-06-19

1999-02-02

McCamish, Marion E.

Compositions

Etching or brightening compositions

2521861, 2521871, 2521872, 25218731, 25218643, 252 792, 438692, 216 89, 216100, 216102, C09K 1300

Patent

active

058660313

ABSTRACT:
Buffered slurries are used in a semiconductor process for chemical mechanical polishing of metal layers, such as aluminum or titanium. The slurries may comprise an oxidant capable of causing a passive oxide film to form on a metal based layer. The oxidant may comprise a diluent and may be optionally formulated with a separate oxidizing agent, such as ammonium peroxydisulfate. The slurries may include a buffer that maintains a slurry pH where the passive metal oxide film is stable. This pH may be between about 4 and about 9.

REFERENCES:
patent: 2171546 (1939-09-01), Kappes
patent: 2434021 (1948-01-01), Thompson et al.
patent: 2939772 (1960-06-01), Newman et al.
patent: 3351555 (1967-11-01), Byers et al.
patent: 3442810 (1969-05-01), Elbreder
patent: 3464908 (1969-09-01), Donaldson
patent: 3498823 (1970-03-01), Jones et al.
patent: 3964956 (1976-06-01), Snyder
patent: 4022625 (1977-05-01), Shelton
patent: 4070193 (1978-01-01), Tucker
patent: 4138228 (1979-02-01), Hartfelt et al.
patent: 4154660 (1979-05-01), Micko
patent: 4512859 (1985-04-01), Inoue
patent: 4600469 (1986-07-01), Fusco et al.
patent: 4728552 (1988-03-01), Jensen, Jr.
patent: 4793895 (1988-12-01), Kaanta et al.
patent: 4944836 (1990-07-01), Beyer et al.
patent: 4956313 (1990-09-01), Cote et al.
patent: 4959113 (1990-09-01), Roberts
patent: 4988369 (1991-01-01), Akay
patent: 5166093 (1992-11-01), Grief
patent: 5203883 (1993-04-01), Perry
patent: 5209816 (1993-05-01), Yu et al.
patent: 5225034 (1993-07-01), Yu et al.
patent: 5234470 (1993-08-01), Lynn et al.
patent: 5340370 (1994-08-01), Cadien et al.
patent: 5364510 (1994-11-01), Carpio
patent: 5373047 (1994-12-01), Schnelle
patent: 5407526 (1995-04-01), Danielson et al.
patent: 5449313 (1995-09-01), Kordonsky et al.
patent: 5472370 (1995-12-01), Malshe et al.
patent: 5527423 (1996-06-01), Neville et al.
patent: 5533923 (1996-07-01), Shamouilian
patent: 5578362 (1996-11-01), Reinhardt et al.
Syromyatnikov et al., "Polymeric Electrolytes for Lithium Chemical Power Sources," Russian Chemical Reviews,64(3):249-257, 1995.
Croce et al., "Synthesis and Characterization of Highly Conducting Gel Electrolytes", Electrochimica Acta, 39(14):2187-2194, 1994.
U.S. application No. 08/572,082 (SEMA:052).
U.S. application No. 08/572,632 (SEMA:053).
U.S. application No. 08/697,409 (SEMA:069).
U.S. application No. 08/908,081 (SEMA:078).
Brusic et al., "Corrosion and Protection of Thin-Line Conductors in VLSI Structures," IBM J. Res. Develop, 37(2):173-188, Mar. 1993.
Carpio et al., "Initial Study on Copper CMP Slurry Chemistries," Thin Solid Films, 266:238-244, 1995.
Farkas et al., "Oxidation and Etching of Tungsten in CMP Slurries," Advanced Metallization for ULSI Applications in 1994, Proceedings of the Conference held Oct. 4-6, 1994, in Austin, Texas, pp. 25-32.
Fury et al., "Chemical-Mechanical Planarization of Aluminum-Based Alloys for Multilevel Metallization," MRS Bulletin, pp. 61-64, Nov. 1995.
O'Mara, "Planarization by Chemical-Mechanical Polishing for Multilevel metal Integrated Circuits," Omara & Associates, Palo Alto, California.
Stern and Geary, "Electrochemical Polarization," Journal of the Electrochemical Society, 104(1):56-63, Jan. 1957.
van Zant, "Ammonium Persulfate as a Stripping and Cleaning Oxidant," Semiconductor International, pp. 109-111, Apr. 1984.
Wang et al., "Chemcial-Mechanical Polishing of Dual Damascence Aluminum Interconnect Structures," Semiconductor International, pp. 117-122, Oct. 1995.
Willard et al., "Modern Voltammetric Techniques, Voltammtery, Polarography, and Related Techniques," Instrumental Methods of Analysis Fifth Edition, D. Van Nostrad Company Publishers, 655-656, 1974.
"Electrochemical Series", CRC Handbook of Chemistry and Physics, 63rd ed., pp. D-162-4, 1983.

Affiliated with

Also associated with

Rating

Slurry formulation for chemical mechanical polishing of metals does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Slurry formulation for chemical mechanical polishing of metals, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Slurry formulation for chemical mechanical polishing of metals will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1113995