Slurry for slicing silicon ingot and method for slicing...

Details Slurry for slicing silicon ingot and method for slicing... Slurry for slicing silicon ingot and method for slicing...

2006-10-20

2011-12-13

McDonough, James (Department: 1731)

Abrasive tool making process, material, or composition

With inorganic material

C051S308000, C051S309000

Reexamination Certificate

active

08075647

ABSTRACT:
The invention is a slurry for slicing a silicon ingot, containing a basic material, such as an alkali metal hydroxide, abrasive powder and water, in which the slurry contains the basic material in an amount of from 2 to 6% by mass and glycerin in an amount of from 25 to 55% by mass, based on a total mass of components of the slurry excluding the abrasive powder.

REFERENCES:
patent: 2689170 (1954-09-01), King
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patent: 10-081872 (1998-03-01), None
patent: 2001-164240 (2001-06-01), None
patent: 2001-164284 (2001-06-01), None
patent: 2005-088394 (2005-04-01), None
“Precision Processing of Crystalline Materials for Electronics,” Jan. 30, 1980, pp. 198-201, Science Forum Inc. (in Japanese—with English summary of Item 3.).
International Search Report for PCT/JP2006/320927, mailed Nov. 21, 2006.

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