Slurry for chemical mechanical polishing of aluminum

Details Slurry for chemical mechanical polishing of aluminum Slurry for chemical mechanical polishing of aluminum

2005-06-29

2010-06-08

Norton, Nadine G (Department: 1792)

Compositions

Etching or brightening compositions

C252S079200, C252S079300, C252S079400, C438S633000, C438S692000, C438S705000, C216S088000

Reexamination Certificate

active

07731864

ABSTRACT:
Described herein are embodiments of a slurry used for the chemical mechanical polishing a substrate that includes aluminum or an aluminum alloy features having a width of less than 1 um. The slurry includes a precipitated silica abrasive having a diameter of less than or equal to 100 nm and a chelating buffer system comprising citric acid and oxalic acid to provide a pH of the slurry in the approximate range of 1.5 and 4.0.

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Office Action from Taiwan Patent Application No. 95123381, mailed Mar. 3, 2009, 13 pgs.
International Preliminary Report on Patentability from PCT/US2006/025749 mailed Jan. 17, 2008, 7 pgs.

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