Slurry containment device for polishing semiconductor wafers

Details Slurry containment device for polishing semiconductor wafers Slurry containment device for polishing semiconductor wafers

1992-07-21

1994-04-05

Kisliuk, Bruce M.

Abrasive tool making process, material, or composition

Impregnating or coating an abrasive tool

51268, 51318, 511311, B24B 5504, B24B 2902

Patent

active

052993930

ABSTRACT:
Liquid abrasive slurry for chemical-mechanical polishing of semiconductor wafers is held on a rotating polish table by a containment device having two continuous circular bonded strips of differing flexibilities. A releasable clamp seals the entire length of the more flexible strip to the table periphery.

REFERENCES:
patent: 2466610 (1949-04-01), Newman
patent: 3148488 (1964-09-01), Reaser
patent: 3233370 (1966-02-01), Best et al.
patent: 3377750 (1968-04-01), Day
patent: 3457682 (1969-07-01), Boettcher
patent: 3818648 (1974-06-01), Evans
patent: 4043081 (1977-08-01), DeTray
patent: 4216629 (1980-08-01), DeGaeta
patent: 4481741 (1984-11-01), Bouladon
patent: 4831784 (1989-05-01), Takahashi
patent: 4891915 (1990-01-01), Yasuda
patent: 4910155 (1990-03-01), Cote
P7872 E/45 SU 893-506, Mechan Autom Des Con 07.01.80-SU-865334.

Affiliated with

Also associated with

Rating

Slurry containment device for polishing semiconductor wafers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Slurry containment device for polishing semiconductor wafers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Slurry containment device for polishing semiconductor wafers will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-504528