Slurry containing manganese oxide

Details Slurry containing manganese oxide Slurry containing manganese oxide

1998-01-27

1999-03-02

Jones, Deborah

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

51306, 51307, 51309, 252 791, 106 11, H01L 21463

Patent

active

058770895

ABSTRACT:
A slurry contains MnO.sub.2 or other manganese oxide as a primary component of abrasive particles. Further, a polishing process using such a manganese oxide abrasive and a fabrication process of a semiconductor device using such a polishing process are disclosed.

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patent: 5498565 (1996-03-01), Gocho et al.
patent: 5593919 (1997-01-01), Lee et al.
patent: 5763325 (1998-06-01), Kishii et al.

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