Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...
Reexamination Certificate
2009-06-08
2011-12-20
Webb, Gregory (Department: 1761)
Cleaning compositions for solid surfaces, auxiliary compositions
Cleaning compositions or processes of preparing
For cleaning a specific substrate or removing a specific...
C252S079100, C438S692000
Reexamination Certificate
active
08080505
ABSTRACT:
The present invention is related to a slurry composition for polishing copper integrated with tungsten containing barrier layers and its use in a CMP method. The present invention is also related to a method for polishing copper integrated with tungsten containing barrier layers by means of an aqueous solution containing abrasive particles, an inorganic acid such as HNO3as etchant for copper that prevents galvanic corrosion of the tungsten containing metal barrier and at least one organic compound to provide sufficient copper corrosion inhibition.
REFERENCES:
patent: 5599977 (1997-02-01), Kiely et al.
patent: 6066028 (2000-05-01), Cheng et al.
patent: 6656022 (2003-12-01), Ota et al.
patent: 6692546 (2004-02-01), Ma et al.
patent: 6896825 (2005-05-01), Uchida et al.
patent: 6899821 (2005-05-01), Uchida et al.
patent: 2002/0004360 (2002-01-01), Ota et al.
patent: 2002/0182851 (2002-12-01), Yeh et al.
patent: 2003/0079416 (2003-05-01), Ma et al.
patent: 2005/0211951 (2005-09-01), Kelley et al.
patent: 2006/0249482 (2006-11-01), Wrschka et al.
patent: 1 533 352 (2005-05-01), None
patent: 2004055861 (2004-02-01), None
patent: WO 01/83638 (2001-11-01), None
patent: WO 02/090025 (2002-11-01), None
patent: WO 03/015148 (2003-02-01), None
patent: WO 2004/101695 (2004-11-01), None
Ernur, D.Corrosion of Copper Interconnects, Jan. 2005, K.U. Leuven, Leuven, XP001206904, Chapter 5.
Ernur Didem
Schuhmacher Jörg
Terzieva Valentina
IMEC
Knobbe Martens Olson & Bear LLP
Webb Gregory
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