Slotted substrates and methods of forming

Details Slotted substrates and methods of forming Slotted substrates and methods of forming

2004-03-03

2008-03-04

Hassanzadeh, Parviz (Department: 1792)

Etching a substrate: processes

Forming or treating thermal ink jet article

Reexamination Certificate

active

07338611

ABSTRACT:
The described embodiments relate to slotted substrates and methods of forming same. One exemplary method forms a first slot portion into a first surface of a substrate, the first slot portion defining a footprint at the first surface. The method also forms a second slot portion through the first slot portion; and, forms a third slot portion through a second surface of the substrate sufficiently to intercept the second slot portion to form a fluid-handling slot through the substrate.

REFERENCES:
patent: 5658471 (1997-08-01), Murthy et al.
patent: 6143190 (2000-11-01), Yagi et al.
patent: 6629756 (2003-10-01), Wang et al.
patent: 6757973 (2004-07-01), Park
patent: 2003/0027426 (2003-02-01), Milligan et al.
patent: 2005/0011752 (2005-01-01), Yamazaki et al.
patent: 1138491 (2001-10-01), None
patent: PCT/US2005/004988 (2005-05-01), None

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