Etching a substrate: processes – Forming or treating thermal ink jet article
Reexamination Certificate
2004-03-03
2008-03-04
Hassanzadeh, Parviz (Department: 1792)
Etching a substrate: processes
Forming or treating thermal ink jet article
Reexamination Certificate
active
07338611
ABSTRACT:
The described embodiments relate to slotted substrates and methods of forming same. One exemplary method forms a first slot portion into a first surface of a substrate, the first slot portion defining a footprint at the first surface. The method also forms a second slot portion through the first slot portion; and, forms a third slot portion through a second surface of the substrate sufficiently to intercept the second slot portion to form a fluid-handling slot through the substrate.
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Miller Michael D.
Pollard Jeffrey R.
Arancibia Maureen G
Hassanzadeh Parviz
Hewlett--Packard Development Company, L.P.
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