Slotted substrates and methods and systems for forming same

Details Slotted substrates and methods and systems for forming same Slotted substrates and methods and systems for forming same

2006-05-09

2006-05-09

Do, An H. (Department: 2853)

Incremental printing of symbolic information

Ink jet

Ejector mechanism

C347S065000

Reexamination Certificate

active

07040735

ABSTRACT:
Methods and systems for forming compound slots in a substrate are described. In one exemplary implementation, a method forms a plurality of slots in a substrate. The method also etches a trench in the substrate contiguous with the plurality of slots to form a compound slot.

REFERENCES:
patent: 5317346 (1994-05-01), Garcia
patent: 5387314 (1995-02-01), Baughman et al.
patent: 5519423 (1996-05-01), Moritz, III et al.
patent: 5751317 (1998-05-01), Peeters et al.
patent: 5980017 (1999-11-01), Sato
patent: 6003986 (1999-12-01), Keefe
patent: 6019457 (2000-02-01), Silverbrook
patent: 6039437 (2000-03-01), Tsujimoto
patent: 6053599 (2000-04-01), Maeda
patent: 6062681 (2000-05-01), Field et al.
patent: 6109744 (2000-08-01), Nishimura
patent: 6113223 (2000-09-01), Tanaka et al.
patent: 6132033 (2000-10-01), Browning et al.
patent: 6161923 (2000-12-01), Pidwerbecki et al.
patent: 6199980 (2001-03-01), Fisher et al.
patent: 6224197 (2001-05-01), Hirasawa et al.
patent: 6270198 (2001-08-01), Ahn et al.
patent: 6273557 (2001-08-01), Milligan et al.
patent: 6280642 (2001-08-01), Ikeda et al.
patent: 6299673 (2001-10-01), Field et al.
patent: 6310639 (2001-10-01), Kawamura et al.
patent: 6331055 (2001-12-01), Miller et al.
patent: 6666546 (2003-12-01), Buswell et al.
patent: 2001/0003460 (2001-06-01), Yoshihira et al.
patent: 0895866 (2000-03-01), None
patent: 2384751 (2003-08-01), None
patent: 2393147 (2004-03-01), None
patent: 2001-58404 (2001-03-01), None
GB Search Report 0325180.8 dated Apr. 16, 2004.

Affiliated with

Also associated with

Rating

Slotted substrates and methods and systems for forming same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Slotted substrates and methods and systems for forming same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Slotted substrates and methods and systems for forming same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3580250