Slotted substrates and methods and systems for forming same

Details Slotted substrates and methods and systems for forming same Slotted substrates and methods and systems for forming same

2002-10-31

2004-01-06

Stephens, Juanita (Department: 2853)

Incremental printing of symbolic information

Ink jet

Ejector mechanism

C347S092000

Reexamination Certificate

active

06672712

ABSTRACT:

BACKGROUND
Inkjet printers and other printing devices have become ubiquitous in society. These printing devices can utilize a slotted substrate to deliver ink in the printing process. Such printing devices can provide many desirable characteristics at an affordable price. However, the desire for more features and lower prices continues to press manufacturers to improve efficiencies. Consumers want, among other things, higher print image resolution, realistic colors, and increased pages or printing per minute. Accordingly, the present invention relates to slotted substrates.


REFERENCES:
patent: 5317346 (1994-05-01), Garcia
patent: 5387314 (1995-02-01), Baughman et al.
patent: 5519423 (1996-05-01), Moritz, III et al.
patent: 5751317 (1998-05-01), Peeters et al.
patent: 5980017 (1999-11-01), Sato
patent: 6003986 (1999-12-01), Keefe
patent: 6019457 (2000-02-01), Silverbrook
patent: 6039437 (2000-03-01), Tsujimoto
patent: 6053599 (2000-04-01), Maeda
patent: 6062681 (2000-05-01), Field et al.
patent: 6109744 (2000-08-01), Nishimura
patent: 6113223 (2000-09-01), Tanaka et al.
patent: 6132033 (2000-10-01), Browning et al.
patent: 6161923 (2000-12-01), Pidwerbecki et al.
patent: 6199980 (2001-03-01), Fisher et al.
patent: 6224197 (2001-05-01), Hirasawa et al.
patent: 6270198 (2001-08-01), Ahn et al.
patent: 6273557 (2001-08-01), Milligan et al.
patent: 6280642 (2001-08-01), Ikeda et al.
patent: 6299673 (2001-10-01), Field et al.
patent: 6331055 (2001-12-01), Miller et al.
patent: 2001/0003460 (2001-06-01), Yoshihira et al.
patent: 2001-58404 (2001-03-01), None

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