Etching a substrate: processes – Forming or treating thermal ink jet article
Reexamination Certificate
2007-07-03
2007-07-03
Alanko, Anita (Department: 1765)
Etching a substrate: processes
Forming or treating thermal ink jet article
C216S041000, C216S049000, C216S051000, C216S079000, C216S099000
Reexamination Certificate
active
10601148
ABSTRACT:
The described embodiments relate to a slotted substrate and methods of forming same. One exemplary method patterns a hardmask on a first substrate surface sufficient to expose a first area of the first surface and forms a slot portion in the substrate through less than an entirety of the first area of the first surface. The slot portion has a cross-sectional area at the first surface that is less than a cross-sectional area of the first area. After forming the slot portion, the method etches the substrate to remove material from within the first area to form a fluid-handling slot.
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GB Search Report for APP 0325044.6,1 Apr. 5, 2004.
Donaldson Jeremy
Obert Jeffrey S.
Truninger Martha A.
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