Incremental printing of symbolic information – Ink jet – Ejector mechanism
Reexamination Certificate
2003-06-20
2004-11-09
Brooke, Michael S. (Department: 2853)
Incremental printing of symbolic information
Ink jet
Ejector mechanism
Reexamination Certificate
active
06814431
ABSTRACT:
BACKGROUND
Inkjet printers and other electronic printing devices have become ubiquitous in society. These printing devices can utilize a slotted substrate to deliver ink in the printing process. Such printing devices can provide many desirable characteristics at an affordable price. However, the desire for ever more features at ever-lower prices continues to press manufacturers to improve efficiencies.
One way of meeting consumer demands is by improving the slotted substrates that are incorporated into print head dies, fluid ejecting devices, printers, and other printing devices. Currently, the slotted substrates can have a propensity to crack and ultimately break. Cracking of the substrate and ultimately the print head die increases production costs as a result of lower yields and decreases product reliability.
Accordingly, the present invention arose out of a desire to provide slotted substrates having desirable characteristics.
REFERENCES:
patent: 5066357 (1991-11-01), Smyth, Jr. et al.
patent: 5317346 (1994-05-01), Garcia
patent: 5361087 (1994-11-01), Tajima et al.
patent: 5378137 (1995-01-01), Asakawa et al.
patent: 5441593 (1995-08-01), Baughman et al.
patent: 5466630 (1995-11-01), Lur
patent: 5588597 (1996-12-01), Reinecke et al.
patent: 5658471 (1997-08-01), Murthy et al.
patent: 5719604 (1998-02-01), Inui et al.
patent: 5786988 (1998-07-01), Harari
patent: 5820919 (1998-10-01), Terai
patent: 5847725 (1998-12-01), Cleland et al.
patent: 5910679 (1999-06-01), Kim
patent: 5953029 (1999-09-01), Keefe et al.
patent: 5988786 (1999-11-01), Waller et al.
patent: 6020270 (2000-02-01), Wong et al.
patent: 6106096 (2000-08-01), Komplin et al.
patent: 6107158 (2000-08-01), Zheng et al.
patent: 6132033 (2000-10-01), Browning et al.
patent: 6133926 (2000-10-01), Kawai et al.
patent: 6142611 (2000-11-01), Pan
patent: 6184570 (2001-02-01), MacDonald, Jr. et al.
patent: 6250738 (2001-06-01), Waller et al.
patent: 6315397 (2001-11-01), Truninger et al.
patent: 6331055 (2001-12-01), Miller et al.
patent: 6348396 (2002-02-01), Ishitsuka et al.
patent: 2001/0023979 (2001-09-01), Brouvillette et al.
Aral, Kazuya, Die Cut Processing Substrate, Die Cut Substrate, and Manufacture of Die Cut Substrate, Sep. 12, 2000, 8 pages.
Momose, Kaoru et al., “Ink-Jet Type Recording Head”, May 23, 2000, 11 pages.
Uenishi, Katsuzo et al., “Thermal Ink Jet Head”, Jan. 11, 2000, 9 pages.
Hida; Katsuharu et al., “Manufacture of Piezoelectric Element For Ink-Jet Head”, Jan. 26, 1999, 6 pages.
Nakazawa, Toshiaki et al., “Ink Jet Head”, Jul. 28, 1998, 6 pages.
Miyagawa, Masashi et al., “Record Head of Ink Jet Recorder”, Jun. 4, 1996, 15 pages.
Naruse, Osamu et al., “Ink Jet Head”, Jan. 9, 1996, 6 pages.
Ota, Yoshihisa et al., “Ink Jet Head”, Jan. 13, 1995, 5 pages.
Miyagawa, Akira, “Wiper Blade of Ink Jet Recording Apparatus”, Sep. 20, 1991, 8 pages.
Bergstrom Deanna J.
Buswell Shen
Frech Daniel
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