Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-11-24
2000-01-04
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361761, 361768, 361782, 310313R, 310348, 22818022, 228189, 29832, 29837, 29840, H05K 334, H01L 41053
Patent
active
060116935
ABSTRACT:
A surface mounting stress relief system for mounting a surface mount package such as a leadless ceramic chip carrier on a printed circuit board includes a printed circuit board having a top layer attached to a bottom layer. The top layer includes cavities for exposing top surface portion of the bottom layer which carry a plurality of solder pads. The surface mount package is positioned on the printed circuit board for placing the package bottom surface on a top surface of the printed circuit board between the cavities while positioning package contact pads in spaced relation above corresponding preselected solder pads. A solder column extends between each of the plurality of corresponding solder pads and the selected contact pads for providing an electrical connection. The solder column is formed by applying a solder paste to the solder pads on the printed circuit board, screening a low temperature solder paste onto each of the contact pads of the surface mount package, placing a solder ball onto each pad, and attaching the solder ball to each of the contact pads of the package by passing the package through a reflow oven for reflowing the low temperature solder paste without reflowing the high temperature solder ball.
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Picard Leo P.
Sawtek Inc.
Vigushin John B.
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