Slotted heat sinks for high powered air cooled modules

Details Slotted heat sinks for high powered air cooled modules Slotted heat sinks for high powered air cooled modules

1979-11-23

1981-10-20

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

361386, 174 16HS, 165 80B, 357 81, H05K 720

Patent

active

042964555

ABSTRACT:
An air cooled high density integrated circuit system wherein heat sink structures are located on one of the surfaces of the modules in the system. The heat sink is composed of a plurality of hollow or flat heat conductive bodies having an opening or openings extending from the module surface toward, but not reaching, the top of the hollow heat sink. Means are provided to direct air flow substantially perpendicular to the upper end of the body. The air flow will be from the top of the heat sink and out of the opening or openings to cool the heat sink and the module. The heat sink structure provides greater surface area and effects the breaking up of the boundary layer near the surface of the module for enhanced cooling.

REFERENCES:
patent: 3193610 (1965-07-01), Worden, Sr.
patent: 3843910 (1974-10-01), Ringuet
patent: 4202408 (1980-05-01), Temple
Variable-Area Heat Sink Device, Connors, IBM Tech. Discl. Bul. vol. 17 No. 4 Sep. 1974 p. 1016.
Thermal Enhancement Technique--, Spaight, IBM Tech. Discl Bull. vol. 20 No. 7 Dec. 1977 p. 2614.
Micro-Modular Air-Cooling Scoop, Simons, IBM Tech. Discl Bull. vol. 22 No. 1 Jun. 1979 p. 240.
Heat Transfer Apparatus for SC Chip, Loeffel, IBM Tech. Discl. Bull. vol. 21, No. 6, Nov. 1978, p. 2430.

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