Slotted cylindrical hollow cathode/magnetron sputtering device

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

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20429812, 20429823, 20419212, C23C 1434

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active

050732455

ABSTRACT:
A magnetron sputtering device for coating planar substrates with sputtered ions. The sputtering occurs from the internal wall of a cylindrical hollow flanged cathode target that includes a slot longitudinally disposed in a sidewall of the cathode. A first portion of sputtered atoms travel through the slot and onto a planar substrate moving relative to the sputtering device and a second portion of sputtered atoms simply redeposit on the internal wall of the cathode target such that the target cathode evenly erodes.

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"Tubular Hollow Cathode Sputtering Onto Substrates of Complex Shape", Thornton et al., 9-16-74.
"Cylindrical Magnetron Sputtering", Thornton et al., from Thin Film Processes, 1978.
"Plasmas in Deposition Processes", John A. Thornton, reproduced from Deposition Technologies for Films and Coatings Developments and Applications, Bunshaw et al., 1982.
"C-Mag Rotatable Magnetron Cathode", Hofman, Airco Coating Technology brochure (date unknown).

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