Slotless type IC carrier

Details Slotless type IC carrier Slotless type IC carrier

1990-05-18

1991-06-25

Abrams, Neil

Electrical connectors

Aligning means for dual inline package

206328, 206331, B65D 7302

Patent

active

050263030

ABSTRACT:
An IC carrier includes an IC accommodating section formed in a central portion of a generally rectangular thin substrate, a lock for holding an IC package body in the IC accommodating section, and a lead wire supporting seat disposed on a substrate portion extending at the periphery of the IC accommodating section and adapted to support lead wire groups projecting sideward from the IC package body. The lead wire supporting seat is defined by a slotless flat surface for accommodating a group of the lead wires over its entire width. The lead wire groups are supported as a package on the lead wire supporting surfaces.

REFERENCES:
patent: 3354394 (1967-11-01), James
patent: 3454921 (1969-07-01), Coleman et al.
patent: 3529277 (1968-05-01), Barnes
patent: 3568129 (1971-03-01), Gold et al.
patent: 3652974 (1972-03-01), Tems
patent: 4435724 (1984-03-01), Ralstin
patent: 4585121 (1986-04-01), Capelle, Jr.
patent: 4747483 (1988-05-01), Grabbe
patent: 4881639 (1989-11-01), Matsuoka et al.

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