Sloped substrate for a thermal head and method of manufacturing

Details Sloped substrate for a thermal head and method of manufacturing Sloped substrate for a thermal head and method of manufacturing

1989-07-10

1990-07-31

Thomas, Alexander S.

Stock material or miscellaneous articles

Perimeter or corner structure of sheet

428192, 428220, 346 76PH, 219216, G01D 1510, B32B 104

Patent

active

049449834

ABSTRACT:
A sloped substrate for a thermal head made of ceramic for a thermal head of a thermosensitive printing device, in which a sloped surface of 200 .mu.m to 2,000 .mu.m in width is formed between a main plane surface of the substrate and a subplane surface thereof and a glaze is bonded by firing to the main plane and the subplane surfaces and the sloped surface so that the thickness of the glaze is 100 .mu.m or less.

REFERENCES:
patent: 4651168 (1987-03-01), Terajima et al.

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