Slim spacer device and manufacturing method

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating

Reexamination Certificate

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C257S344000, C257SE29266

Reexamination Certificate

active

10816089

ABSTRACT:
A CMOS structure including a Slim spacer and method for forming the same to reduce an S/D electrical resistance and improve charge mobility in a channel region, the method including providing a semiconductor substrate including a polysilicon gate structure including at least one overlying hardmask layer; forming spacers selected from the group consisting of oxide
itride and oxide
itride oxide layers adjacent the polysilicon gate structure; removing the at least one overlying hardmask layer to expose the polysilicon gate structure; carrying out an ion implant process; carrying out at least one of a wet and dry etching process to reduce the width of the spacers; and, forming at least one dielectric layer over the polysilicon gate structure and spacers in one of tensile and compressive stress.

REFERENCES:
patent: 6046494 (2000-04-01), Brigham et al.
patent: 6140192 (2000-10-01), Huang et al.
patent: 6566254 (2003-05-01), Mikagi
patent: 6656853 (2003-12-01), Ito
patent: 6897526 (2005-05-01), Miyanaga et al.
patent: 6927117 (2005-08-01), Cabral, Jr. et al.
patent: 11233769 (1999-08-01), None

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