Sliders bonded by a debondable nonstoichiometric encapsulant

Details Sliders bonded by a debondable nonstoichiometric encapsulant Sliders bonded by a debondable nonstoichiometric encapsulant

2006-07-18

2006-07-18

Hassanzadeh, Parviz (Department: 1763)

Etching a substrate: processes

Forming or treating article containing magnetically...

Reexamination Certificate

active

07077970

ABSTRACT:
A slider assembly is provided comprising a plurality of sliders bonded by a debondable solid encapsulant. The solid encapsulant is comprised of a polymer prepared by polymerizing a mixture of first and second monomers in a nonstoichiometric ratio effective to render the encapsulant debondable. Each slider has a surface that is free from the encapsulant. The encapsulant-free surfaces are coplanar to each other. Also provided are methods for forming the assembly and methods for patterning a slider surface using the encapsulant.

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