Slider-suspension assembly and method for attaching a slider to

Dynamic magnetic information storage or retrieval – Record transport with head stationary during transducing – Drum record

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29603, 360104, G11B 560

Patent

active

047616997

ABSTRACT:
In a data disk file a slider is mechanically attached to the suspension by means of reflowed solder balls. A pattern of solder contact pads is formed on the back side of the slider and a similar pattern of solder-wettable regions is formed on the suspension. Solder balls are formed on either the solder contact pads or the solder-wettable regions, the slider is located on the suspension so that the solder balls are in registration between the solder contact pads and solder-wettable regions, and the solder is heated to reflow, thereby forming solder joints as a mechanical connection between the slider and suspension. When a thin film transducer is formed on the slider trailing edge and the suspension is a laminated type with patterned conductors, solder balls are also formed on the transducer lead terminations on the trailing edge and on a row of solder-wettable regions on the suspension near the location where the trailing edge of the slider is to be located. In this embodiment, when the slider with thin film transducer, with solder balls on the lead terminations, is located over the suspension then all of the solder balls are heated. The solder balls for providing mechanical connection collapse during reflow, thereby causing the solder balls on the transducer lead terminations to come in contact with and flow together with the solder balls formed on the row of solder-wettable regions on the suspension. Thus the mechanical attachment of the slider is made simultaneously with the electrical connection of the transducer lead to the disk file read/write electronics.

REFERENCES:
patent: 3564522 (1971-02-01), Stevens, Jr.
patent: 4462534 (1984-07-01), Bitaillou et al.
patent: 4546541 (1985-10-01), Reid
J. R. Reidenbach, "Combination Suspension-Lead cable for a Multi-Gap Read/Write Head", IBM Technical Disclosure Bulletin, vol. 22, No. 4 (Sep. 1979), pp. 1602-1603.
W. A. Warwick, "Multilayer Ceramic Slider for Thin-Film Heads", IBM Technical Disclosure Bulletin, vol. 15, No. 7 (Dec. 1972), pp. 2183-2184.
M. A. Church, et al., "Method for Wiring a Magnetic Head", IBM Technical Disclosure Bulletin, vol. 23, No. 8, (Jan. 1981), pp. 3873-3874.
R. B. Watrous, "Magnetic Head Suspension Assembly", IBM Technical Disclosure Bulletin, vol. 24, No. 10 (Mar. 1982), p. 4915.
B. R. Aimi, "Solder Reflow Pin Head to Chip Carrier Connection", IBM Technical Disclosure Bulletin, vol. 16, No. 8 (Jan. 1974), p. 2597.
E. N. Chase, et al., "Semiconductor Solder Reflow Chip Substrate Joining", IBM Technical Disclosure Bulletin, vol. 16, No. 8 (Jan. 1974), p. 2675.
B. R. Aimi, "Multi-Chip Carrier", IBM Technical Disclosure Bulletin, vol. 23, No. 5 (Oct. 1980), pp. 1833-1834.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Slider-suspension assembly and method for attaching a slider to does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Slider-suspension assembly and method for attaching a slider to , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Slider-suspension assembly and method for attaching a slider to will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-714297

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.