Slicing method

Details Slicing method Slicing method

2011-08-02

2011-08-02

Rose, Robert (Department: 3727)

Abrading

Precision device or process - or with condition responsive...

Controlling temperature

C451S053000, C125S016020

Reexamination Certificate

active

07988530

ABSTRACT:
The present invention provides a slicing method comprising winding a wire around a plurality of grooved rollers and pressing the wire against an ingot to be sliced into wafers while supplying a slurry for slicing to the grooved rollers and causing the wire to travel, wherein a cooling speed of the ingot when a slicing depth is equal to or above ⅔ of a diameter is controlled to perform slicing by supplying a slurry for adjusting an ingot temperature to the ingot independently from the slurry for slicing while controlling a supply temperature only in a period from the moment that the slicing depth of the ingot reaches at least ⅔ of the diameter to end of slicing. As a result, the slicing method is provided, in which rapid cooling of the ingot in the time close to end of slicing the ingot can be alleviated when a wire saw is used to slice the ingot, and generation of a nano-topography can be thereby suppressed and further high quality wafers having a uniform thickness are obtained by slicing.

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patent: A 9-262826 (1997-10-01), None
patent: A 2003-1624 (2003-01-01), None
patent: WO 00/43162 (2000-07-01), None

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