Slicing machine for cutting semiconductor material

Details Slicing machine for cutting semiconductor material Slicing machine for cutting semiconductor material

1988-07-25

1990-02-27

Schmidt, Frederick R.

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

5116577, 175 12, 36447406, B25B 4900

Patent

active

049034375

ABSTRACT:
Slicing machine having a handle to be driven manually to generate command pulses. By revolving the handle, a feedtable is moved at the operator's command, enabling the positioning of a semiconductor material at the right position to start slicing. The thickness of the first wafer cut off from the material as well as other wafers, has a predetermined thickness, so that no wafer is wasted.

REFERENCES:
patent: 4294045 (1981-10-01), Enomoto et al.
patent: 4324073 (1982-04-01), Belthle
patent: 4368596 (1983-01-01), Wada et al.

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