Slicing and grinding system for a wafer slicing machine

Details Slicing and grinding system for a wafer slicing machine Slicing and grinding system for a wafer slicing machine

1989-05-18

1992-05-12

Schmidt, Frederick R.

Abrasive tool making process, material, or composition

With carbohydrate or reaction product thereof

51 73R, 51 34J, 511659, 51283R, 125 1301, B24B 700

Patent

active

051116227

ABSTRACT:
A grinding wheel is mounted coaxially of an internal diameter saw blade and rotates with the saw blade during operation. The grinding wheel includes a grinding disc and a center rod which is movably mounted within a central bore of the spindle of the slicing machine. Compressed fluid such as air is used to move the grinding wheel from a retracted position to an extended position against the bias of a spring secured to the center rod. The pressurized fluid is introduced into a chamber for moving an annular sleeve-like piston removably secured to the grinding disc. An adjustable stop ring is also mounted on an adaptor within the sleeve-like piston and has ears which can be deflected by screws from access openings in the grinding disc for fine running adjustments of the grinding disc. This stop ring can be accessed upon removal of the grinding disc from the center rod and sleeve-like piston in order to permit coarse initial adjustments in the positioning of the grinding disc.

REFERENCES:
patent: 3828758 (1974-08-01), Cary
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patent: 4112624 (1978-07-01), Uhtenwoldt et al.
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patent: 4399898 (1983-08-01), Olschewski et al.
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patent: 4616447 (1986-10-01), Haas et al.
patent: 4716881 (1988-01-01), Steere
patent: 4785540 (1988-11-01), Underhaug
patent: 4852304 (1989-08-01), Honda et al.

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