Skin package with transparent back window

Details Skin package with transparent back window Skin package with transparent back window

1976-10-20

1977-12-13

Marcus, Stephen

Special receptacle or package

Article housing attached to panel

Housing contoured to retain article

53 22A, 206 4534, B65D 7300, B65B 1152

Patent

active

040624498

ABSTRACT:
A skin package having a single backing board having an adhesion-promoting coating on one side, an opening through the board, a transparent window covering that opening and a transparent heat-sealable thermoplastic film extending over the board and covering product disposed over and displayed through the window. The backing board with its adhesion-promoting coating is permeable to the passage of air. The material of which the transparent window is formed is in most cases substantially impermeable to the passage of air. It covers all of the window but substantial gas-permeable area around the window remains. The window is preferably heat sealed to the adhesion promoting layer. The top film, which may be either preformed or extruded in situ, is vacuum drawn around the product displayed and is heat sealed.

REFERENCES:
patent: 2861405 (1958-11-01), Hanford
patent: 3090484 (1963-05-01), Scholl
patent: 3202278 (1965-08-01), Taylor
patent: 3307693 (1967-03-01), Bittner
patent: 3380583 (1968-04-01), Goodman
patent: 3433694 (1969-03-01), Nuttall
patent: 3507383 (1970-04-01), Rorer
patent: 3734798 (1973-05-01), Dooley
patent: 3784004 (1974-01-01), Meyer
patent: 3796306 (1974-03-01), Swezey
patent: 3803332 (1974-04-01), Seiferth

Affiliated with

Also associated with

Rating

Skin package with transparent back window does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Skin package with transparent back window, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Skin package with transparent back window will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-485167