Measuring and testing – Dynamometers – Responsive to multiple loads or load components
Reexamination Certificate
2005-10-04
2005-10-04
Lefkowitz, Edward (Department: 2855)
Measuring and testing
Dynamometers
Responsive to multiple loads or load components
Reexamination Certificate
active
06951142
ABSTRACT:
A thin plate-shaped six-axis force sensor chip comprising a semiconductor substrate formed by semiconductor film-forming processes, the sensor chip having through-holes formed therein and arranged so that the sensor chip is functionally divided by the through-holes into an action part to which an external force is applied, a support part to be fixed to an external structure, and a plurality of connecting parts each connecting together the action part and the support part and having a bridge portion of generally T-shaped configuration joined to the action part and an elastic portion joined to the support part. Each of the connecting parts has a plurality of strain resistance devices each comprising an active layer formed on at least one of front and rear faces thereof in an area thereof where deformation strain effectively occurs, the strain resistance devices being electrically connected to corresponding electrodes disposed in the support part.
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Hirabayashi Yusuke
Ohsato Takeshi
Honda Giken Kogyo Kabushiki Kaisha
Lefkowitz Edward
Miller T
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