Situ metal plating of the cathode terminal surface of an electro

Details Situ metal plating of the cathode terminal surface of an electro Situ metal plating of the cathode terminal surface of an electro

1980-12-19

1982-12-21

Tufariello, T.

Chemistry: electrical and wave energy

Processes and products

204 32R, 204 38R, C25D 502, C25D 534

Patent

active

043648002

ABSTRACT:
A process for plating a metal, preferably gold, onto the exposed surface of a cathode terminal of an electrochemical cell. The cell is contacted with a solution containing the metal ions to be plated thereon. The cell is then permitted to self-discharge through the solution for a given period of time which causes the metal to plate out, at a given thickness, onto the surface of the cathode terminal in contact with the solution. In a preferred form, the process includes the steps of first activating the surface of the terminal by contacting it with a solution containing hydroxide ions.

REFERENCES:
patent: 3066084 (1962-11-01), Osterman, Jr.
patent: 3389060 (1968-06-01), Greene
patent: 3880730 (1975-04-01), Wright
patent: 4287031 (1981-09-01), Good

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