Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate
2011-02-22
2011-02-22
Monbleau, Davienne (Department: 2893)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
C257SE23031
Reexamination Certificate
active
07893548
ABSTRACT:
Disclosed in this specification is a system-in-a-package substrate that includes an interconnect substrate for permitting finely pitched connections to be made to an integrated circuit. The interconnect substrate includes a central region on its upper surface for receiving the integrated circuit. The interconnect substrate also has interconnections that electrically connect the finely pitched contacts on the upper surface to larger pitched contacts on the lower surface. The larger pitched contacts connect to a conductive trace frame. The resulting assembly is encased in a molding compound along with a plurality of other devices which are configured to interact with one other through the conductive trace.
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patent: 7061077 (2006-06-01), Joshi
patent: 7141874 (2006-11-01), Nakatani
patent: 7309913 (2007-12-01), Shim et al.
patent: 2006/0226534 (2006-10-01), Liang et al.
patent: 2008/0290497 (2008-11-01), Sugaya et al.
patent: 05 59847 (1993-08-01), None
International Search Report and Written Opinion of corresponding PCT application (PCT/US2009/036452 filed Mar. 9, 2009) completed Aug. 31, 2009 (total 6 pages).
Madrid Ruben P.
Quinones Maria Clemens Y.
Fairchild Semiconductor Corporation
FitzGerald Esq. Thomas R.
Hiscock & Barclay LLP
Mikesell Peter J.
Monbleau Davienne
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