Sintered rare earth magnetic alloy wafer and wafer surface...

Details Sintered rare earth magnetic alloy wafer and wafer surface... Sintered rare earth magnetic alloy wafer and wafer surface...

2007-09-25

2007-09-25

Ackun, Jr., Jacob K. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

C148S101000, C148S105000, C148S301000

Reexamination Certificate

active

11227151

ABSTRACT:
A method of producing a sintered rare earth magnetic alloy wafer comprises a step of using a cutter to slice a wafer of a thickness of not greater than 3 mm from a sintered rare earth magnetic alloy having ferromagnetic crystal grains surrounded by a more readily grindable grain boundary phase and a step of surface-grinding at least one cut surface of the obtained wafer with a grindstone to form at a surface layer thereof flat ferromagnetic crystal grain cross-sections lying parallel to the wafer planar surface. The method enables high-yield production of a sintered rare earth magnetic alloy wafer having flat surfaces.

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Metals Handbook Ninth Edition, vol. 16, 1989, pp. 121-123.
Metals Handbook, Ninth Edition, vol. 16, 1989, pp. 453-456.

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