Stone working – Sawing – Disk cutting
Reexamination Certificate
2000-06-06
2001-11-20
Banks, Derris H. (Department: 3723)
Stone working
Sawing
Disk cutting
C451S339000, C125S023010
Reexamination Certificate
active
06318354
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a singulation system for a BGA (ball grid array) product, more particularly, to a singulation system for a BGA product containing an revolving arm assembly.
2. Description of Related Art
Since there is no special singulation device for BGA production, the current solution is to use the procedure and equipment for cutting wafers. However, the high cost of the equipment for cutting wafers has driven BGA producers to placing a high priority on identifying low cost but tough alternatives.
Therefore, there is a need for a singulation system specifically for BGA products, which can smooth and accelerate the cutting process for BGA products.
SUMMARY OF THE INVENTION
The objective of the present invention is to provide a singulation system for BGA products, which can smooth and accelerate the cutting process for BGA products.
To achieve the objective, the singulation system for a BGA product in accordance with the present invention comprises a cutting mechanism having a cutting head, a conveyor belt, a cutting table, a cleaning station, a loading frame capable of moving up and down, a cassette storage containing multiple receiving cassettes (each having a BGA product contained therein), a gripping device and an revolving arm assembly with three revolving arms.
When the singulation system for BGA products in accordance with the present invention is operated, the loading frame is lifted or lowered to align with a receiving cassette containing the BGA product to be cut. Then the gripping device grips the receiving cassette in the cassette storage and pulls it along the loading frame to a predetermined position. The revolving arm assembly will simultaneously remove the receiving cassettes on the cutting table and on the cleaning station and place the new cassette on the cutting table. Thus, multiple BGA receiving cassettes, instead of only one BGA receiving cassette, are removed in a cutting operation so as to accelerate and smooth the cutting procedure.
Obviously, the square singulation table and loading frames are the most impression features for potential users. It not only provides a compact working area but also makes the singulation work more flexible and effective. Conventional devices and procedures require four times the mounting space and the requisite software design support.
Other objectives, advantages, and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
REFERENCES:
patent: 5852870 (1998-12-01), Freyman et al.
patent: 6020218 (2000-02-01), Shim et al.
patent: 6124637 (2000-09-01), Freyman et al.
Chen Hugo
Chen Venus
Chien James
Ko Boss
Seng Wei-Chun
Banks Derris H.
Rosenberg , Klein & Lee
Uni-Tek System, Inc.
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