Metal working – Method of mechanical manufacture – Electrical device making
Patent
1997-08-20
2000-04-11
Young, Lee
Metal working
Method of mechanical manufacture
Electrical device making
29846, 29415, 29412, 83 35, H05K 302
Patent
active
06047470&
ABSTRACT:
A circuit board substrate assembly includes a generally planar circuit board substrate material having a longitudinal axis extending along a length of the substrate material between a first end and a second end thereof. The circuit board substrate material further has a first edge and a second edge extending along the length of the circuit board substrate material between the first end and the second end. A plurality of openings are defined in the substrate material. Each opening extends between a first distance from the first edge of the circuit board substrate and a second distance from the second edge of the circuit board substrate. Further, each opening separates adjacent circuit forming regions lying along the longitudinal axis and has first and second opposing end portions. The first end portions of each opening lie along a first singulation axis of the substrate material parallel to the longitudinal axis and the second end portions of each opening lie along a second singulation axis of the substrate material parallel to the longitudinal axis. Removing interconnect material along the first singulation axis and second singulation axis provide for singulation of the circuit forming regions and any circuits thereof.
REFERENCES:
patent: 3780431 (1973-12-01), Feeney
patent: 4316320 (1982-02-01), Nogawa et al.
patent: 4426773 (1984-01-01), Hargis
patent: 4532839 (1985-08-01), Easton
patent: 4621552 (1986-11-01), Lopez
patent: 4742615 (1988-05-01), Lopez
patent: 4791721 (1988-12-01), Anderson et al.
patent: 5483857 (1996-01-01), Ziberna
patent: 5488886 (1996-02-01), Mohr
patent: 5773764 (1998-06-01), Von Vajna
Drussel Zane
Hinkle Derek
Micro)n Technology, Inc.
Trinh Minh
Young Lee
LandOfFree
Singulation methods does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Singulation methods, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Singulation methods will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1167942