Singulation method used in leadless packaging process

Details Singulation method used in leadless packaging process Singulation method used in leadless packaging process

2007-04-17

2007-04-17

Fourson, George (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Outside periphery of package having specified shape or...

C257S694000, C257S700000, C257S707000, C257S731000, C257S798000, C257SE23004, C257SE23015, C257SE23123

Reexamination Certificate

active

10878521

ABSTRACT:
A singulation method used in leadless packaging process is disclosed. An array of molded products on an upper surface of a lead frame is utilized in the singulation method. The lead frame has a plurality of dambars between the molded products. The lower surface of the lead frame is attached with a tape. Each of the molded products includes a semiconductor chip encapsulated in a package body and electrically coupled to the upper surface of the lead frame. The singulation method is accomplished by etching the upper surface of the lead frame with the package bodies as mask until each dambar is etched away.

REFERENCES:
patent: 6281047 (2001-08-01), Wu et al.
patent: 6399415 (2002-06-01), Bayan et al.
patent: 6872599 (2005-03-01), Li et al.
patent: 2005/0064695 (2005-03-01), Hiatt et al.

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