Singulation method of semiconductor device

Details Singulation method of semiconductor device Singulation method of semiconductor device

2007-12-19

2010-06-01

Everhart, Caridad M (Department: 2895)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S906000, C257SE21599, C257SE21606

Reexamination Certificate

active

07727812

ABSTRACT:
Provided is a singulation method of a semiconductor device that can perform a sawing process while protecting a pad. In the singulation method for forming a semiconductor device including a scribe lane region and a chip region, pads are formed in the chip region. Photoresist patterns exposing the scribe lane region and covering the pads are formed, and a substrate in the scribe lane region is cut and a washing solution is sprayed on the scribe lane region. According to the method, wafers can be stably separated from each other while pads of a semiconductor device are protected, so that stabilization in the fabrication process can be realized and pad corrosion caused by DI water is prevented during a sawing process. Accordingly, a defective device is minimized and reliability of a device can improve.

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