Singulating surface-mountable semiconductor devices and...

Details Singulating surface-mountable semiconductor devices and... Singulating surface-mountable semiconductor devices and...

2007-03-29

2009-02-03

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S113000, C438S121000, C438S124000, C438S462000, C257SE23006, C257SE21510, C257SE21511, C257SE21521

Reexamination Certificate

active

07485493

ABSTRACT:
Methods for singulating surface-mountable semiconductor devices and for fitting external contact areas to the devices are described herein. Semiconductor device components are applied to a metallic carrier in rows and columns in corresponding semiconductor device positions of the metallic carrier. Thereafter, a plurality of components, situated in the device positions, is embedded into a plastic housing composition, thereby producing a composite board. The composite board is subsequently separated into individual semiconductor devices by laser ablation, the semiconductor devices being inscribed on their top sides via the laser technique. The top sides with the inscription can then be adhesively bonded to an adhesive film, so that the undersides of the devices can be uncovered while maintaining the semiconductor device positions.

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