Singular molded and co-molded electronic's packaging pre-forms

Details Singular molded and co-molded electronic's packaging pre-forms Singular molded and co-molded electronic's packaging pre-forms

2008-04-15

2008-04-15

Tentoni, Leo B. (Department: 1791)

Plastic and nonmetallic article shaping or treating: processes

With measuring, testing, or inspecting

C264S225000, C264S255000, C264S272110, C264S272130, C264S272170

Reexamination Certificate

active

07357886

ABSTRACT:
Molded pre-forms that are used to protect electronic components and assemblies from damage due to vibration, shock and/or thermal exposure. The pre-forms can be singularly molded or co-molded. Co-molded pre-forms can include hard surface layers over softer molded compositions. The pre-forms are molded in molds that are formed using modified images obtained from printed circuit boards having the electronic components thereon. Images of the printed circuit boards are obtained and modified to improve vibrational dampening and/or heat transfer. The molded pre-forms allow for access to the printed circuit boards for purposes of replacing or repairing the printed circuit boards. The molded pre-forms are particularly suitable for down hole applications.

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