Single wafer type substrate cleaning method and apparatus

Details Single wafer type substrate cleaning method and apparatus Single wafer type substrate cleaning method and apparatus

2006-04-18

2006-04-18

Perrin, Joseph L. (Department: 1746)

Cleaning and liquid contact with solids

Processes

Including use of vacuum, suction, or inert atmosphere

C134S033000, C134S037000, C034S487000, C034S510000

Reexamination Certificate

active

07029538

ABSTRACT:
In the drying step of the single wafer type substrate cleaning system for cleaning wafers not stored in a cassette, in a sealed cleaning housing, a spin drying treatment is applied to the wafer when the wafer is supported and rotated at high speed while an inert gas for preventing oxidation is supplied to the face of the wafer, and the amount of the inert gas to be supplied to the face of the wafer is larger at the outer peripheral portion of the wafer than that supplied at the center thereof, thereby preventing oxidation on the face of the wafer effectively while optimizing the benefits of the single wafer type cleaning system.

REFERENCES:
patent: 4544446 (1985-10-01), Cady
patent: 5377708 (1995-01-01), Bergman et al.
patent: 6190732 (2001-02-01), Omstead et al.
patent: 6270584 (2001-08-01), Ferrell et al.

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