Single-tiered organic chip carriers for wire bond-type chips

Details Single-tiered organic chip carriers for wire bond-type chips Single-tiered organic chip carriers for wire bond-type chips

1995-02-15

1998-08-25

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174252, 174257, 257707, 257738, 361761, 361717, 361718, H05K 118, H05K 720, H01L 23488

Patent

active

057989095

ABSTRACT:
A chip carrier for wire bond-type chips is disclosed. This chip carrier employs organic dielectric materials, rather than ceramic materials, as is conventional. This chip carrier also employs at least one organic, photoimageable dielectric layer, having plated photo-vias, to electrically interconnect two (or more) layers of fan-out circuitry. This chip carrier further employs a single-tiered cavity to contain a chip, rather than a multi-tiered cavity, as is conventional. Moreover, this chip carrier includes thermal via holes and/or a metallic layer, directly beneath the chip, to enhance heat dissipation.

REFERENCES:
patent: 4640010 (1987-02-01), Brown
patent: 4729061 (1988-03-01), Brown
patent: 4773955 (1988-09-01), Mabuchi et al.
patent: 5036163 (1991-07-01), Spielberger et al.
patent: 5045921 (1991-09-01), Lin et al.
patent: 5081562 (1992-01-01), Adachi et al.
patent: 5102829 (1992-04-01), Cohn
patent: 5124884 (1992-06-01), Yazu et al.
patent: 5239448 (1993-08-01), Perkins et al.
patent: 5285352 (1994-02-01), Pastore et al.
patent: 5291062 (1994-03-01), Higgins, III
patent: 5324985 (1994-06-01), Hamada et al.
patent: 5340771 (1994-08-01), Rostoker
patent: 5355280 (1994-10-01), Rothlingshofer et al.
patent: 5355283 (1994-10-01), Marrs et al.
patent: 5357672 (1994-10-01), Newman
patent: 5363278 (1994-11-01), Komorita et al.
patent: 5397917 (1995-03-01), Ommen et al.
patent: 5409865 (1995-04-01), Karnezos
patent: 5420460 (1995-05-01), Massingill
patent: 5468994 (1995-11-01), Pendse
patent: 5519936 (1996-05-01), Andros et al.
patent: 5545923 (1996-08-01), Barber
patent: 5583377 (1996-12-01), Higgins, III
patent: 5599747 (1997-02-01), Bhatt et al.
IBM Technical Disclosure Bulletin "Photoformed Chip Carrier" vol. 28 No. 7 Dec.1985 pp. 2918 and 2919.
IBM Technical Disclosure Bulletin "Solder Bump-Making Process" vol. 32 No. 3B Aug. 1989 pp. 36 and 37.
IBM Technical Disclosure Bulletin "Photo-Defined Lamination For Chip Bonding" by J. C. Edwards vol. 25 No. 4 Sep. 1982 pp. 1952 and 1953.

Affiliated with

Also associated with

Rating

Single-tiered organic chip carriers for wire bond-type chips does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Single-tiered organic chip carriers for wire bond-type chips, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Single-tiered organic chip carriers for wire bond-type chips will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-40338