Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Patent
1995-03-21
1997-09-16
Tsai, Jey
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
29 2501, 414231, 414235, 414243, 414783, 438907, H01L 2168
Patent
active
056680562
ABSTRACT:
A manufacturing system for individually processing semiconductor wafers through a plurality of processing stations. The system has a plurality of processing stations, a multilevel track system that interfaces with the processing stations, and guided transport vehicles that operate on the track system to move individual wafers in wafer carriers between the stations. The carriers have a storage memory that contains the required process sequence and the capability to remember the completed process steps.
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Chen I. I.
Chen Taylor
Lai Jack
Wu Hong Jen
Tsai Jey
Turner Kevin F.
United Microelectronics Corporation
Wright William H.
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