Single point bonding method and apparatus

Details Single point bonding method and apparatus Single point bonding method and apparatus

1987-05-19

1988-10-11

Godici, Nicholas P.

Metal fusion bonding

Process

Plural joints

228 11, 228 54, 228 562, B23K 3102

Patent

active

047765097

ABSTRACT:
A single point bonding apparatus and method for bonding one electrical conductor to a second electrical conductor by a thermosonic process using force, time, temperature and ultrasonic energy as the key parameters in forming the bonds. A bonding tool has a tip with a multiple of nonparallel surfaces extending from the end of the tip for maximizing the amount of ultrasonic energy coupled to the electrical conductors. The surfaces may be recessed into the end of the tip or protrude outwardly from the end of the tip for coupling ultrasonic energy in directions both parallel and perpendicular to the conductors.

REFERENCES:
patent: 3822465 (1974-07-01), Frankfort et al.
patent: 3917146 (1975-11-01), Culp
patent: 3934783 (1975-09-01), Larrison
patent: 4030657 (1977-06-01), Scheffer

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