Single point bonding method

Details Single point bonding method Single point bonding method

1995-11-21

1997-06-03

Heinrich, Samuel M.

Metal fusion bonding

Process

Using high frequency vibratory energy

228111, 228212, H01L 21607

Patent

active

056345860

ABSTRACT:
A single point bonding method used in individually bonding, for example, the leads of a pad of a chip to a pad of a circuit board, including the steps of forming a pressure scar at the free end of each lead by a bonding tool, catching the irregular portions of the thus made pressure scar by the end of the bonding tool so as to move the free end of the lead towards its fixed end and then bonding the lead to a corresponding pad.

REFERENCES:
patent: 3934783 (1976-01-01), Larrison
patent: 4422568 (1983-12-01), Elles et al.
patent: 4619397 (1986-10-01), Urban
patent: 4998002 (1991-03-01), Okikawa et al.
pp. 215-223 of "TAB Gijutsu Nyumon [Introduction to TAB Techniques]", written by Kenzo Hatada and issued by Kogyo Chosakai in Jan., 1990.

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