Single piece integrated package and optical lid

Radiant energy – Photocells; circuits and apparatus – Housings

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Details

257433, H01J 502

Patent

active

059328754

ABSTRACT:
A lid for protecting and covering an integrated circuit provided in a chip-on-board package is disclosed. The lid has a wall surrounding the integrated circuit, and a top cover covering the integrated circuit, with the wall and top cover provided in a single piece.

REFERENCES:
patent: 5130531 (1992-07-01), Ito et al.
patent: 5453638 (1995-09-01), Nagele et al.
patent: 5567972 (1996-10-01), Abe
patent: 5691536 (1997-11-01), Shimoyama et al.
patent: 5783815 (1998-07-01), Ikeda

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