Single phase tungsten-titanium sputter targets and method of pro

Details Single phase tungsten-titanium sputter targets and method of pro Single phase tungsten-titanium sputter targets and method of pro

1996-04-10

1999-04-20

Wyszomierski, George

Powder metallurgy processes

Powder metallurgy processes with heating or sintering

Powder shape or size characteristics

419 32, 419 49, 20429813, 420430, B22F 312

Patent

active

058965530

ABSTRACT:
A single phase W-Ti sputter target and a method of manufacturing the target are disclosed. The target is produced by mixing powders of tungsten and titanium and subjecting the mixed powders to a pressing operation for a time, temperature and pressure sufficient to achieve a mutual solid solution of W and Ti, forming single .beta.(Ti,W) phase. The single phase sputtering target emits much less particulate during sputtering than conventional multiphase W-Ti targets of comparable density and composition.

REFERENCES:
patent: 4838935 (1989-06-01), Dunlop et al.
patent: 5234487 (1993-08-01), Wickersham, Jr. et al.
patent: 5306569 (1994-04-01), Hiraki
patent: 5470527 (1995-11-01), Yamanobb et al.
patent: 5760317 (1998-06-01), Kapoor
"Development of W-Ti Binary Alloy Sputtering Target and Study of its Sputtering Characteristics" by Masahiro Yamauchi and Toshizane Kibayashi, Nippon Tungsten Review, vol. 22 (1989) pp. 55-72.
"The Role of Tungsten-Titanium Target Density On Particulate Generation" by J.C. Turn Jr., Ph.D. and Dr. R. Marx, Ph.D., Materials Research Corporation, Advanced Materials Division, Technical Note #1263, 1992.

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