Heat exchange – Conduit within – or conforming to – panel or wall structure
Patent
1993-01-08
1993-12-07
Davis, Jr., Albert W.
Heat exchange
Conduit within, or conforming to, panel or wall structure
165170, 165907, 16510426, 122366, F28F 312
Patent
active
052676110
ABSTRACT:
The invention is a cooling structure for a high power density surface. Liquid is pumped along interconnected and continuous multiple channels on the backside of a sintered metal wick bonded to the cooled surface. The channels are located within a liquid delivery layer which also includes multiple liquid outlet holes, so that each outlet hole is surrounded by interconnected channels. The outlet holes are connected to a manifold to collect the pumped liquid. The input channels which surround each outlet hole are fed from manifolds at the edges of the panels, and the proximity of input channels to the outlet holes assures that liquid flow resistance within the sintered metal wick is minimized by the multiple short, wide paths.
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Davis Jr. Albert W.
Fruitman Martin
Thermacore, Inc.
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