Single package epoxy resin system

Details Single package epoxy resin system Single package epoxy resin system

1983-09-07

1985-08-06

Kight, John

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

From reactant having at least one -n=c=x group as well as...

525396, 525438, 525526, 525529, 528 73, 528 98, 528102, 528107, 528361, 548323, 548341, C08G 1881, C08G 1828

Patent

active

045337152

ABSTRACT:
A curing agent for one package epoxy resin systems is disclosed as a imidazole blocked naphthyl diisocyanate which, when incorporated in epoxy resins, has an extended shelf life and can be cured by exposure to relatively low temperatures. The curing agent is insoluble in epoxy resins that are liquid at room temperature and is useful in connection therewith.

REFERENCES:
patent: 4293561 (1981-10-01), Walker
patent: 4335228 (1982-06-01), Beitchman et al.
patent: 4358571 (1982-11-01), Kaufman et al.

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